The Company

Hesse & Knipps GmbH develops and delivers customer specific equipment for the back-end semiconductor industry: bonders, ultrasonic flip-chip systems and special systems right up to complete production lines.

Core competence is the consistent customer orientation, high innovation power and the application of state of the art technology.  We invest in all relevant technologies to achieve maximum technical abilities and with the interaction of mechanics, electrics/electronics and software we are able to generate optimum solutions.

Examples are the development of a series of wear-free piezo bondheads in a simplistic construction: a development which gained world-wide recognition.  Another example is the patented process integrated quality control which measures friction, frequency, current, voltage and deformation in real-time.

We are positioned world-wide with subsidiaries in Hong Kong and the USA.  We are networked world-wide and deliver to over 30 countries.