News

CIPS Conference in Nuremberg Infineon´s statement: The Future of Wire Bonding is? (Cu) Wire Bonding

Maximum Junction temperature for switching operation is going to increase. Current assembly and interconnect technologies have to change for module setup that consistently meets reliability requirements at higher temperature and swing in ...

Productronica Munich: BJ935/BJ939 will be introduced

Hesse & Knipps introduces their new Bondjet models BJ935 and BJ939, which will set a new benchmark for the process speed as well as precision ...

Hesse & Knipps to Introduce Wire Bonder for Solar Market

San Jose, CA, July 16, 2008 - Hesse & Knipps, leading manufacturer of high-speed, fine pitch wedge bonders for the back-end semiconductor industry, announces that it will soon introduce a new wire bonder dedicated to the needs of the solar ...

Quality Control

The world wide unique process integrated quality control PiQC is being tested since the beginning of 2007 by one of our long-standing customers. PiQC records all relevant signals from a transducer integrated sensor and ultrasonic generator. ...

IMAPS Germany

Hesse & Knipps is intensively involved within the IMAPS, the International Microelectronics and Packaging Society. In 2007, Mr. Hans-Ulrich Knipps became treasurer of the directorate.