Current Products - Overview
Wedge Bonder
- Fully automatic thin wire bonder:
BONDJET BJ820
BONDJET BJ715/815
- Fully automatic heavy wire bonder
BONDJET BJ93X BONDJET BJ920 BONDJET BJ915L - Available options:
PiQC
E-Box
Flipchip Bonder
- Fully automatic ultrasonic Flip Chip bonder:
Flipjet FJ520
TPT Semi Automatic
Automation
- Overview
- Indexers
- Lifts
- Heating Tables
- Specific workholders, manual
Realtime Manufacturing Monitoring
- Process Control:
PBS200
Special Equipment
- According to customer specifications
- Complete production lines
